HiBy Digital Xeno
1. Product Overview
2. Headphone technical characteristics
- Full-link digital audio playback architecture
- HIBY has been deeply involved in the application of high-definition first-frequency technology. HIBY has complete vertical design capabilities and independent intellectual property rights in terms of audio architecture, key algorithms, FPGA circuits, analog circuits, etc.

Therefore, in Xeno, Xinghaibei’s new digital headset, we see a series of high-resolution digital audio playback architectures that open up the entire link, from high-definition digital sound sources, independent master control, high-definition decoding, active crossover to all-silicon solid-state speakers and graphene unit hybrid drivers.
- Smaller and lighter
- Thanks to breakthroughs in size and mid- and high-frequency performance of MEMS drivers, Xeno Xeno digital headphones have an excellent sense of lightness. Among high-performance hybrid driver headphones, Xeno is 35% smaller in size and 40% lighter in weight, greatly improving comfort and portability.
- From xMEMS CoweIl built-in solid-state microelectromechanical tweeter
- The revolutionary all-silicon solid-state microelectromechanical MEMS unit launched by xMEMS - CoweIl, has a fast response speed that is 150 times that of traditional sound units, and can reduce phase offset to a large extent, showing a high degree of phase consistency, which helps to uniquely express high-resolution music.
- Special graphene full frequency domain moving coil unit
- As a tough and thin nanomaterial, graphene has very high strength, which can greatly reduce the segmentation vibration that is easy to occur in traditional diaphragm materials, ultimately allowing the unit diaphragm to have better resolving power. The 10mm dynamic speaker specially designed for Xeno is equipped with a new generation of graphene film, which makes the earphone diaphragm light, rigid and sufficient, providing solid and full sound performance.
- A new hybrid acoustic cavity created by high-precision 3D printing and low standing wave metal back cavity
- Because the MEMS tweeter adopts a new sound generation principle, the adaptation design of its sound cavity is very different from the common units in the past. Therefore, we used high-precision 3D printing technology to create the Xeno hybrid speaker bracket, and created independent LSW acoustic rear cavities for the two units in a small space. The lightweight one-piece aluminum alloy reduces the standing waves in the sound cavity and brings clearer sound performance.
- Independent master control and active two-way crossover architecture independently developed by HIBY Music
- From Haiby Music's dual DAC decoding design, especially for Xeno's ring-silicon hybrid acoustic architecture, we developed exclusive data stream processing and algorithms, using a heterogeneous dual DAC approach to debug an accurate frequency division scheme for two speakers with different characteristics, allowing the dedicated DAC to drive the dedicated speaker and adapt to their respective driving parameters. This not only allows for more accurate frequency division driving, but also allows two sets of speakers with different characteristics to cooperate with each other to make the derivation of sound bands smoother and more natural. Later, users can also have a richer sound experience through presets or interaction with the Haibei Music APP.
- Innovative heterogeneous HIFI-level dual DAC high-definition dual-drive architecture
- Due to the different characteristics of Cowell tweeters and graphene moving coil units, we consistently selected and adapted the two sets of units separately. The exclusive HiFi-level DAC chip ES9018C2M&CS43131 decodes, divides and independently amplifies the signal to maximize the acoustic characteristics of the two sets of units, making different sounds more expressive.
- 15ms ultra-low latency, ultra-high fidelity pure digital signal processing
- Through specially customized high-performance digital cables and digital interfaces, Xeno itself can independently process the native digital signals of smartphones/tablets, not only allowing users to listen to ultra-clear high-resolution music, but also in audio-visual entertainment or e-sports games without heart-to-heart delay issues, allowing users to have an immersive listening experience anytime and anywhere.

Frequency response diagram

3. Headphone operating instructions
This headset can adjust the PEQ mode/volume. The operation is as follows:

- FN multi-function button
- Volume down
- play/pause
- Volume up
The FN multi-function button can switch between three different sound styles, HiFi mode, dynamic mode, and theater/e-sports mode. You can also adjust PEQ/EQ through HiBy Music HiBy USBMaster and write it into HiFi mode to have a richer and more independent sound experience. HiBy USBMaster website: https://www.hiby.app/usbmaster/en/
4. Headphone hardware parameters
| Headphone cover material | 3D printing process |
|---|---|
| Single-sided driver unit | xMEMS solid-state all-silicon speaker × 1 10mm graphene dynamic speaker × 1 |
| Decoding specifications | DSD128 PCM384kHz/32Bits |
| Wire specifications | Skin-friendly braided wire Audiophile-grade silver-plated headphone cable Native Type-C |
| Whether to support Haibei Music exclusive mode | Support |
| Whether Switch mode is supported | Supported |
| Cord length | 1.35cm |
| Whether to bring a microphone | Equipped with a high-sensitivity silicon microphone, supporting calls and high-definition recording |
| Weight | 5g (one side) |
5. Acoustic parameters
| Comprehensive impedance | 33Ω |
|---|---|
| Frequency response | 20-40,000 Hz |
| Total harmonic distortion | < 0.1% |
| Maximum output power | |
| Sensitivity |
6. How to wear headphones
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Both the left and right sides of this headset and its wire need to be distinguished. L represents the left ear and R represents the right ear. The L/R mark of the headset is located next to the earphone vent. The L/R mark of the wire is located inside the 2-pin double-pin male connector. The correct connection method between the headset and the wire is as follows:
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After connecting and assembling the earphones, wear them around the ears. The correct wearing method is as follows. When wearing, please choose an earphone cover of the appropriate size according to your ear size to ensure a tight and comfortable wearing feeling. This earphone is an in-ear earphone. Poor sealing will cause low-frequency loss, reduced sound quality analysis, etc., affecting the listening effect. Please wear it normally.
7. Things to note when wearing HiFi headphones
- When wearing or storing headphones, please avoid high temperature, low temperature, humid or dusty environments to prevent damage to the headphones or affect the sound quality. It is recommended to store them in a special moisture-proof storage bag to reduce damage.
- Do not immerse the earphones in water to prevent liquid from entering the unit or cable. If there are water stains after use, wipe them dry in time.
- Avoid excessive pulling or bending of the headphone cable, which may cause internal breakage of the line.
- Avoid dropping the earphones hard to prevent internal parts from loosening.
- When connecting the device, do not insert or pull out the plug forcefully to avoid damaging the plug or device interface.
- When wearing it for a long time, you need to let your ears rest for a while to avoid ear fatigue and hearing damage; at the same time, avoid listening at high volume for a long time, which can not only protect your hearing, but also better preserve the unit performance.
- If the earphones malfunction (such as sound quality distortion, silence, poor contact, etc.), please do not disassemble and repair it yourself. You should contact the brand's official after-sales service to avoid affecting the product warranty.
- When cleaning the earphones, please use a dry and soft cloth to wipe them. Do not use corrosive cleaners such as alcohol and acetone to avoid damaging the unit casing and wire sheath. Pay attention to regular cleaning of the earphone covers to keep them clean and hygienic.